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Capability

Drilling
Minimum mechanical drilling aperture 8 mil (0.2mm) +/- 0.002" 0.05MM
Maximum mechanical drilling aperture 236 mil (6.0mm) +/- 0.002" 0.05MM
Minimum laser drilling aperture 4 mil (0.1mm)
Maximum aspect ratio 1:8

Lamination
No. of layers 1-12 Layer
Maximum thickness 137.79mil (3.5.00mm)
Minimum thickness (four layers) 15.8 mil (0.4mm)
Minimum thickness (double-sided) 8mil (0.2mm)
Maximum working dimension 530X 720mm
Minimum thickness of the inner layer 2.5 mil (0.06mm) copperless
Minimum PP thickness 2.6mil (0.066mm)
Maximum thickness of the external layer of copper 3.0 oz
Minimum thickness of the external layer of copper 0.3 oz

Plating of Primary Copper
Maximum aspect ratio 1:8
Minimum aperture of plating through hole 8 mil (0.2mm)

Wiring
Maximum thickness of the internal layer of copper 3.0 oz
Minimum thickness of the internal layer of copper 0.3 oz
Maximum thickness of the external layer of copper 3.0 oz
Minimum thickness of the external layer of copper 0.3 oz
Width/spacing of external wiring 4/4 mil
Width/spacing of internal wiring 4/4 mil
Minimum SMT land width 7mil (0.18 mm)
Minimum BGA land diameter 6 mil (0.15 mm)
Plating of Secondary Copper
Width/spacing of external wiring 4/4 mil
Minimum SMT land width  7mil (0.18 mm)
Minimum BGA land diameter  6 mil (0.15 mm)
Solder Mask
Minimum solder mask printing width 3 mil (0.075 mm)
Control over positioning error of solder mask ± 3 mil
Color of solder mask Green, yellow, blue, red, white, black

CNC

Maximum working dimension 600*500mm
Shape tolerance ± 0.1mm
Minimal Tool path 0.8mm

我們接受各式保險計劃
我們接受各式保險計劃

製程技術

 
   
項 目 已生產能力
層數 1-12 Layer
基板 / PP
最大板厚 137.79mil (3.5.00mm)
最小板厚(四層板) 11.8 mil (0.3mm)
最小板厚(雙面板) 8mil (0.2mm)
最小內層板厚 3 mil (0.067mm)不含銅3 mil (0.067mm)不含銅
最大工作尺寸 530X 720mm
最小PP厚度 2.6mil (0.066mm)
銅厚
最大內層銅厚 3.0 oz
最小內層銅厚 0.3 oz
最大外層銅厚 3.0 oz
最小外層銅厚 0.3 oz
通孔線路疊構
最小鑽孔孔徑 8 mil (0.2mm)
最小雷射孔徑 4 mil (0.1mm)
最大縱橫比 1:8
線路配置
外層線路之線寬 / 距 4/4 mil
內層線路之線寬 / 距 4/4 mil
最小SMT焊墊間距 7mil (0.18 mm)
最小 BGA焊墊間距 6 mil (0.15 mm)
防焊及表面處理
最小防焊印刷寬度 3 mil (0.075 mm)
防焊對位誤差控制 ± 3 mil
其它 GBR操作軟體
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